Digi ConnectCore 6 module, i.MX6Quad, 1.2 GHz, -20 to 70°C, 4 GB flash, 1 GB DDR3, Microcontroller Assist (MKL14Z32VFT4), 802.11a/b/g/n, Bluetooth 4.0, Ethernet (*MOQ May Apply)

Description

Digi ConnectCore 6 module, i.MX6Quad, 1.2 GHz, -20 to 70°C, 4 GB flash, 1 GB DDR3, Microcontroller Assist (MKL14Z32VFT4), 802.11a/b/g/n, Bluetooth 4.0, Ethernet (*MOQ May Apply)
CC-WMX-J97C-TN

The Digi ConnectCore 6 is an ultra-compact and highly integrated system-on-module solution based on the NXP/Freescale i.MX6 Cortex-A9 processor family.

With processor speeds up to 1.2 GHz and fully pin-compatible single-/dual-/quad-core variants, the ConnectCore 6 offers a truly future-proof platform solution with scalable performance and pre-certified wireless 802.11a/b/g/n and Bluetooth 4.0, including Bluetooth Low Energy, connectivity.

Its low-profile, surface-mount design maximizes integration flexibility and significantly reduces design risk in a highly cost- effective, reliable form factor with optimized heat dissipation capabilities even in the most demanding quad-core system configurations .

Integrated cloud integration as part of the Digi Linux and Android software platform support offers secure remote management and web services capabilities through the scalable Digi Device Cloud.

Features

Scalable Cortex-A9 multi-core performance
Microcontroller Assist™ option on module
Cost-effective, reliable, low-profile surface-mount form factor
Pre-certified 802.11a/b/g/n and Bluetooth 4.0 connectivity
Designed for reliability and long-term availability
Linux, Android and Windows Embedded support
Turnkey development available from Digi WDS
Documentation
PDF Hardware Reference Manual
Specifications Digi ConnectCore 6
Application Processor NXP/Freescale i.MX6Solo/DualLite/Dual/Quad with up to four Cortex-A9 cores
Industrial (800/850 MHz), Commercial (1/1.2 GHz) i.MX6 variants
32 KB I-Cache/32 KB D-Cache, up to 1 MB L2-Cache
Memory Up to 64 GB eMMC flash, up to 2 GB DDR3 (64-bit)
PMIC Dialog DA9063
Graphics Multi-stream-capable HD video engine with 1080p60 decode, 1080p30 encode and 3D video playback in HD in high-performance families; Superior 3D graphics performance with up to 4 shaders at 200 Mt/s w/OpenCL support; Separate 2D and/or Vertex acceleration engines for UI support; Stereoscopic image sensor support for 3D imaging
Security RNG, TrustZone, Ciphers, Security Cntrl, Secure RTC, Secure JTAG, eFuses (OTP)
Peripherals/Interfaces MMC 4.4/SD 3.0 x3MMC 4.4/SDXC, UART x5 (5 Mbps), MIPI HSI, S/PDIF Tx/Rx, I2C x3, SPI x5, ESAI, I2S/SSI x3, FlexCAN x2, MLB150 + DTCP, S-ATA and PHY (3 Gbps), USB2 OTG and PHY, USB 2.0 Host and PHY, USB 2.0 HSIC Host x2, PWM, 3.3V GPIO, Keypad, PCIe 2.0 (x1 lane), HDMI and PHY, MIPI DSI, MIPI CSI2, 20-bit CSI, 24-bit RGB, LVDS (x2), RTC, External address/data bus, Watchdog, Timers, JTAG
External Bus 26-bit address / up to 32-bit data (multiplexed and non-multiplexed modes)
Ethernet 1 Gbit Ethernet + IEEE 1588 (MII10, MII100, RMII, RGMII)
Wi-Fi 802.11a/b/g/n:
2.412 – 2.484 GHz, 4.900 – 5.850 GHz
802.11b: 1, 2, 5.5, 11 Mbps (17 dBm typical ±2 dBm)
802.11a/g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps (15 dBm typical ±2 dBm)
802.11n: 15, 30, 45, 60, 90, 120, 135, 150 Mbps (12 dBm typical ±2 dBm)
HT40, MCS 0-7
Security: WEP, WPA-PSK/WPA2-Personal, WPA/WPA2 Enterprise, 802.11i, Access Point Mode (up to 10 clients), Wi-Fi Direct
Industry Certifications: Wi-Fi Alliance Logo Certification Ready, CCXv4 ASD Ready
Bluetooth Profiles: GAP, SPP, FTP, PAN, OPP, HID, A2DP, AVRCP, HDP
On-Module Microcontroller Assist Kinetis L: MKL14Z32VFT4, MKL14Z64VFT4, MKL15Z128VFT4, MKL15Z32VFT4, MKL15Z64VFT4, MKL24Z32VFT4, MKL24Z64VFT4,
MKL25Z128VFT4, MKL25Z32VFT4, MKL25Z64VFT4, MKL26Z128VFT4, MKL26Z64VFT4, MKL26Z32VFT4
Kinetis K: K10P48M50SF0, K20P48M50SF0
Internal interconnect to i.MX6 via SPI, Kinetis interfaces available on module pads
Operating Temperature (Tj) Industrial: -40° C to +85° C / Commercial: 0° C to +70 C° (depending on use-case and enclosure/system design)
Storage Temperature Storage Temperature -50° C to +125° C (-58° F to +257° F)
Relative Humidity Relative Humidity 5% to 90% (non-condensing)
Altitude Altitude 12,000 feet (3,658 meters)
Radio Approvals US, Canada, EU, Japan, Australia/New Zealand
Emissions / Immunity / Safety FCC Part 15 Class B, EN 55022 Class B, EN 61000-3-2, EN 61000-3-3, ICES-003 Class B, VCCI Class II, AS 3548, FCC Part 15 Subpart C Section 15.247, IC (Industry Canada), RSS-210 Issue 5 Section 6.2.2(o), EN 300 328, EN 301 489-17, EN 55024, EN 301 489-3, Safety UL/UR (or equivalent)
Design Verification Temperature: IEC 60068-2-1, IEC 60068-2-2, IEC 60068-2-78
Vibration/Shock: IEC 60068-2-6, IEC 60068-2-64, IEC 60068-2-27, HALT
Mechanical Dimensions LGA-400, 2 mm pitch, fully shielded (heat-spreading)
Product Warranty 3 years