Digi ConnectCore i.MX 6UL-2 Secure Wireless Module, 528 MHz, Industrial Temp, 1GB SLC NAND, 1GB DDR3, Dual 10/100 Ethernet, 802.11a/b/g/n/ac, Bluetooth 4.2 (*MOQ May Apply)

Description

Digi ConnectCore i.MX 6UL-2 Secure Wireless Module, 528 MHz, Industrial Temp, 1GB SLC NAND, 1GB DDR3, Dual 10/100 Ethernet, 802.11a/b/g/n/ac, Bluetooth 4.2 (*MOQ May Apply)
CC-WMX-JN7A-NE

The Digi ConnectCore® 6UL module delivers a secure and extremely cost-effective connected System-on-Module platform that is slightly bigger than a postage stamp. Its patent-pending Digi SMTplus™ surface mount form factor allows you to choose simplified design integration leveraging proven and easy-to-use edge-castellated SMT technology, or a versatile LGA option for ultimate design flexibility with access to virtually all interfaces.

Built on the NXP i.MX6UL UltraLite application processor, the module is the intelligent communication engine for today’s secure connected devices. It seamlessly integrates dual-Ethernet and pre-certified dual-band Wi-Fi (802.11a/b/g/n/ac) with Bluetooth 4.2 connectivity.

Embedded device security is a critical design aspect for the growing number of connected applications (“IoT”) and the ConnectCore 6UL removes the implementation barriers by providing you with Digi TrustFence, a fully integrated secure module platform with complete Linux software support.

Features

Stamp-sized, secure, connected System-on-Module platform
NXP i.MX6UL-2, Cortex-A7 @ 528 MHz
256MB/1GB NAND flash, 256MB/1GB DDR3
Patent-pending low-profile Digi SMTplus™ form factor
Integrated Microcontroller Assist™ for 2.5 µA ultra-low power modes
Pre-certified 802.11a/b/g/n/ac + Bluetooth 4.2 option
Integrated dual 10/100 Ethernet connectivity
Exclusive Digi TrustFence® embedded device security framework
Royalty-free embedded Linux software platform
Turnkey development available from Digi WDS
Specifications Digi ConnectCore 6UL
FEATURES
APPLICATION PROCESSOR NXP i.MX6UL-2, ARM® Cortex®-A7 @ 528 MHz, 128 KB L2 cache, with NEON™ MPE (Media Processor Engine) co-processor and programmable smart DMA (SDMA) controller
MEMORY 256MB/1GB NAND flash, 256MB/1GB DDR3
PMIC NXP PF3000
VIDEO/GRAPHICS 2D Pixel Processing Pipeline (PXP) for color-space conversion, scaling, alpha-blending, and rotation, 8-/16-/18-/24-bit parallel LCD Display up to WXGA (1366×768), 8/10/16/24-bit Parallel CSI with BT.656 support
SECURITY** AIS-31 compliant TRNG, ECC/AES256/TDES/ RSA encryption/decryption co-processor, SHA-1/224/256, FameXE PKI co-processor with 4096-bit RSA,/544-bit ECC/ ECDSA support, Secure RTC, Secure JTAG, Secure Storage, Secure Key Management, SPA/DPA/DFA (power/timing/fault attack protection), Tamper Monitor, Digi TrustFence® Embedded Security Framework
PERIPHERALS/INTERFACES 1 x dedicated MMC 4.5/SD 3.0/SDIO Port (1-/2-4-bit), 2 x USB 2.0 OTG with PHY, 3x I2S/SAI, 1 x S/PDIF Tx/Rx, 2 x FlexCAN (2.0b), 4 x I2C, 4 x SPI, 7 x UART, 4 x Timer, 8 x PWM, 3 x Watchdog, 2 x 12-bit ADC (10 channels) with 4-wire/5-wire touch controller, up to 103 GPIOs
EXTERNAL BUS 16-bit address / up to 16-bit data (multiplexed and non-multiplexed modes)
ETHERNET Dual 10/100 Mbit Ethernet MAC + IEEE 1588
WIRELESS 802.11a/b/g/n/ac 1×1 (MCS 0-9), Bluetooth 4.2 with strong WPA2-Enterprise authentication/encryption for Wi-Fi connections
MCA™ MICROCONTROLLER ASSIST Ultra-low power ARM® Cortex®-M0+, up to 48 MHz (NXP Kinetis KL03: KL03P24M48SF0)
OPERATING TEMPERATURE -40° C to +85° C
STORAGE TEMPERATURE -50° C to +125° C
RELATIVE HUMIDITY Relative humidity 5% to 90% (non-condensing)
ALTITUDE Altitude 12,000 feet (3,658 meters)
RADIO APPROVALS US, Canada, EU, Japan, Australia/New Zealand
EMISSIONS / IMMUNITY / SAFETY FCC Part 15 Class B, EN 55022 Class B, EN 61000-3-2, EN 61000-3-3, ICES-003 Class B, VCCI Class II, AS 3548, FCC Part 15 Subpart C Section 15.247, IC (Industry Canada), RSS-210 Issue 5 Section 6.2.2(o), EN 300 328, EN 301 489-17, EN 55024, EN 301 489-3, Safety UL/UR (or equivalent)
DESIGN VERIFICATION Temperature: IEC 60068-2-1, IEC 60068-2-2, IEC 60068-2-78; Vibration/Shock: IEC 60068-2-6, IEC 60068-2-64, IEC 60068-2-27, HALT
MOUNTING / PIN COUNT Common Digi SMTplus* surface mount footprint using 76-pad edge castellated pads (1.27 mm pitch) or 245-pad LGA (1.27 mm pitch) option
MECHANICAL DIMENSIONS 29 mm x 29 mm x 3.5 mm
POWER CONSUMPTION Idle Mode (Linux up, no networking): 100mA @ 5V
Idle Mode (Linux up, with 25% Wi-Fi transmit): 118mA @ 5V
Standby Mode (w/memory refresh): 6mA @ 5V
ULTRA LOW-POWER MODES Event Trigger Mode: 2.5 µA @ 3V (i.MX6UL off, MCA LLS w/HS Comparator active)
Scheduled Wake-Up Mode: 2.5 µA @ 3V (i.MX6UL off, MCA LLS w/HS Comparator active)
PRODUCT WARRANTY 3 years