Digi ConnectCore i.MX53 800MHz, 512MB Flash, 1GB RAM, 2xEthernet, Industrial Temp (*MOQ May Apply)

Description

Digi ConnectCore i.MX53 800MHz, 512MB Flash, 1GB RAM, 2xEthernet, Industrial Temp (*MOQ May Apply)
CC-MX-LD79-ZK

The network-enabled Digi ConnectCore for i.MX53 is a highly integrated and future-proof system-on-module (SoM) solution based on the new NXP/Freescale i.MX53 application processor with a high performance 1 GHz ARM Cortex-A8 core, wired and wireless connectivity, powerful 1080p/720p video encoding/decoding capabilities, dual-CAN bus interface and a complete set of peripherals.

The Digi ConnectCore for i.MX53 family builds on the successful ConnectCore for i.MX51 modules by providing a form factor compatible option with significantly improved processing, memory, video and connectivity capabilities. It is a scalable and energy-efficient module family that is ideal for medical devices, security/surveillance equipment, industrial applications, kiosk systems and digital signage integration.

The ConnectCore for i.MX53 modules combine industry-leading performance, low power consumption and easy design integration with key features like integrated power management IC, on-chip multimedia support, including multi-format 1080p video hardware decoding, 2D/3D graphics acceleration, dual display/camera interface, hardware encryption engine, 802.11abgn Wi-Fi interface (150 Mbps), Bluetooth 4.0 with HDP support, dual 10/100 Ethernet option, dual-CAN bus, SATA II storage interface and a comprehensive set of additional peripherals.

Modules in the ConnectCore i.MX family feature the design, development and administrative advantages offered by Digi Remote Manager. This robust cloud platform makes it easy to configure and manage deployments and integrate devices with virtually any application. Device manufacturers can build secure, highly scalable and cost-effective solutions that seamlessly tie assets to applications, regardless of location.

Complete and cost-efficient Digi JumpStart Kits® for Digi Embedded Linux, Android and Microsoft Windows Embedded Compact 7 allow immediate and professional embedded product development with dramatically reduced design risk and time-to-market. Additional support for Yocto Embedded Linux is also available for download.
Features

Integrated secure wireless 802.11a/b/g/n Wi-Fi WLAN
Powerful 2D/3D graphics, 1080p video
Support for Embedded Linux, Microsoft Windows Compact 7, Android, and Yocto Project Linux
Industrial operating temperature system-on-module (SoM)
Documentation
PDF Hardware Reference Manual
Specifications Digi ConnectCore i.MX53 Digi ConnectCore Wi-i.MX53
Processor
Processor Model NXP/Freescale® i.MX535/i.MX537
Speed Grades 1000/800 MHz
Core Type ARM® Cortex™-A8
Cache Memory 32k L1 I-Cache, 32k L1 D-Cache, 256k L2-Cache (unified)
Internal RAM 128 KB (secure/non-secure)
Vector Floating Point •
NEON Media Acceleration •
Memory
Flash Up to 8 GB NAND flash
RAM Up to 2 GB DDR2
Debug
Secure JTAG •
ETM/ETB •
Power Management
Power Modes Run, Wait, Stop, Low-power screen refresh
Wake-up Events GPIO, keypad, RTC (day/time of day), SD card/USB cable insertion, battery/charger attach
Dynamic Voltage and Frequency Scaling •
Backlight Drivers 3
Battery Management •
Real Time Clock
Battery Backup (External) •
Security
Hardware encryption/decryption AES, DES/3DES, RC4, C2
RSA, ECC
MD5, SHA-1/224/256
Random Number Generator •
Run Time Integrity Checker •
Secure RAM (internal) •
Fuse Box (e-Fuses) 64 Bits (application-specific use)
Physical Tamper Detectors •
Timers
General Purpose Timer 32-bit up-counter with clock source selection
2 input capture channels
3 output compare channels, forced compare
Enhanced Periodic Interrupt Timer 32-bit down-counter with clock source selection
Set-and-forget/free-running modes
Precision interrupt generation
Watchdog •
Thermal Management
Temperature Monitor On-chip sensor, precision 0 to 135°C ±5°C
Software support for thermal-aware Dyamic Frequency and Voltage Scaling (DFVS)
Connectivity
UART Up to 3 channels with bit rates up to 4 MHz, IrDA 1.0 support
IrDA Infrared Medium InfraRed (0.576/1.152 Mbps), Fast InfraRed (4 Mbps)
CAN Up to 2 channels, up to 1 Mbps each, CAN 2.0b (available on i.MX537 variant)
CSPI Master and slave mode
Bit rate up to 25 Mbps (master)
eCSPI Up to 2 eCSPI channels, master and slave mode, bit rates up to 52 Mbps
I 2C Up to 2 eCSPI channels, master and slave mode
Bit rates up to 66.5 Mbps (master)
SD/SDIO/MMC/eMMC Up to 4 ports, 1-/4-/8-bit modes
MMC: Up to 416 Mbps (8-bit mode), SD/SDIO: Up to 200 Mbps (4-bit mode)
eMMC 4.4: Ultra high speed, up to 832 Mbps
I 2C Up to 3 channels, master/slave (7-/10-bit addressing)
All: Standard (100 kbps) and fast (400 kbps) mode
P-ATA Up to 66 MB/s data rate
PIO mode (0,1,2,3,4), multi-word DMA mode (0,1,2), Ultra DMA mode (0,1,2,3,4,5)
SATA SATA II, up to 1.5 Gbps
USB 2.0 High-Speed Up to 3 USB 2.0 High-Speed Host ports (one with integrated PHY)
Up to 1 USB 2.0 OTG port with integrated PHY
Media Local Bus (MLB)

MOST (Media Oriented Systems Transport) interface, up to 50 Mbps

1-Wire •
ISO 7816 (SIM/Smart Card) •
Keypad 8×8 keypad matrix
PWM 2
ADC (10-bit) Up to 4 channels
GPIO Up to 128 GPIOs
External Memory Bus 16-bit data/28-bit address in non-multiplexed address/data mode
16-bit or 32-bit data/28-bit address in multiplexed address/data mode
Multimedia
Camera

Two parallel camera ports, up to 20-bit, up to 120 MHz peak

Display

5 interfaces available – with total rate of all interfaces up to 180 Mpixels/sec, 24 bpp

Up to 2 displays can be driven simultaneously (screen refresh)

Concurrent asynchronous access to 2 additional devices, e.g. display controllers and smart displays

Parallel: 2 24-bit display ports, up to 165 Mpixels/sec, e.g. UXGA @ 60 Hz

LVDS: 1 port up to 165 Mpixels/sec or 2 ports up to 85 Mpixels/sec, e.g. WXGA @ 60 Hz

1 TV-out/VGA port, up to 150 Mpixels/sec, e.g. 1080p60

Image Processing Unit Image enhancements, video/graphics combining, resizing, rotation/inversion, color conversion/correction
Video Processing Unit MPEG-4, H.263, H.264, MPEG-2, VC-1, DivX, RV10, MJPEG

1080p30 decode, 720p30 encode
GPU (2D/3D) 33 million triangles/sec, 200 million pixels/sec raw

OpenVG 1.0, OpenGL ES Common Profile v1.0/v1.1/Direct3D Mobile, OpenGL ES Profile v2.0
Touchscreen Interface (4-wire) •
SPDIF (Tx) •
I 2S/AC97/SSI Up to 3 channels
ESAI

Multi-channel digitial audio, up to 1.4 Mbps each channel

ASRC •
Ethernet
Physical Layer 10/100Base-T
Data Rates 10/100 Mbps, auto-sensing
Duplex Mode Full or half duplex, auto-sensing
IEEE 1588 Yes, primary interface only (available on i.MX537 variant)
Power over Ethernet (802.3af)
Power Over Ethernet Development board ready for 802.3af PoE application kit (sold separately)
Accelerometer
Three-Axis Accelerometer ±2g/±4g/±8g Three-Axis Low-g
(Freescale MMA7455L)
Wireless LAN
Standard N/A 802.11a/b/g/n (2.4/5 GHz)
Antenna Connectors N/A 2 x U.FL
Dual Diversity (Receive) N/A •
Frequency Bands N/A 2.412 – 2.484 GHz
4.900 – 5.850 GHz
Data Rates N/A 802.11b: 1, 2, 5.5, 11 Mbps
802.11a/g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
802.11n: 6.5, 13, 19.5, 26, 39, 52, 58.5, 65 (MCS 0-7)
Modulation N/A DBPSK, DQPSK, CCK, BPSK, QPSK, 16-QAM, 64-QAM
802.11n Features N/A A-MPDU / A-MSDU, PSMP, MTBA, STBC, Greenfield Preamble, RIFS
Transmit Power (±2 dBm) N/A 802.11b: 17 dBm typical
802.11g/n: 15 dBm typical
802.11a: 12 dBm typical
Security N/A WEP, WPA-PSK/WPA2-Personal, WPA/WPA2 Enterprise, 802.11i
QoS N/A WMM, WMM-PS, 802.11e
Roaming Enhancements N/A 802.11k/r
Extended Range (802.11n) N/A •
Radio Certifcations N/A USA, Canada, EU, Japan
Power Requirements 1
Typical/Idle 700 mA @ 3.75 V / 200 mA @ 3.75 V
Mechanical
Dimensions (L x W x H) 82 mm x 50 mm x 6.5 mm 82 mm x 50 mm x 8 mm
Module Connectors 2 x 180-pin board-to-board connectors
(Mating connector FCI P/N 61083-184409LF or similar)
Environmental
Operating Temperature -40°C to +85°C (i.MX537, 800 MHz)
-20°C to +70°C (i.MX535, 1000 MHz)
Storage Temperature -40° C up to +85° C (-40° F to +185° F)
Relative Humidity 5% to 90% (non-condensing)
Altitude 12,000 feet (3,658 meters)
Temperature / Climate Tests IEC 60068-2-1 (Ab/Ad Cold: 16 h with -40°C), IEC 60068-2-2 (Bb/Bd: Dry heat: 16 h with +85°C), IEC 60068-2-78 (Damp heat steady state: 16h with +40°C and 93%rH)
Vibration / Shock Tests IEC 60068-2-6 Method Fc, IEC 60068-2-64 Method Fh, IEC 60068-2-27 Method Ea
Regulatory Approvals
FCC Part 15 Class B •
FCC Part 15 Sub C Section 15.247 •
IC RSS-210 Issue 5 Section 6.2.2(o) •
EN55022:2006 Class B •
ICES-003, Class B •
VCCI, Class B •
EN55024:1998 +A1:2001, A2:2003 •
EN61000-3-2:2006 •
EN61000-3-3:1995 +A1:2001, A2:2005 •
EN60950-1:2001
(UL60950-equivalent) •
CSA C22.2, No. 60950 •
Product Warranty 3 years