Digi XBee-PRO S2C DigiMesh, 2.4GHz,SMT (PCB Ant) (*MOQ May Apply)

Description

Digi XBee-PRO S2C DigiMesh, 2.4GHz,SMT (PCB Ant) (*MOQ May Apply)
XBP24CDMPIS-001
Digi XBee DigiMesh® 2.4 delivers end-point device connectivity with a globally deployable 2.4 GHz transceiver. These modules use the innovative DigiMesh® networking protocol. This innovative, peer-to-peer protocol offers users added network stability through self-healing, dense network operation and with a very low housekeeping overhead, it is capable of extending the operational life of battery dependent networks.

Digi XBee modules are ideal for low-power, low-cost applications. Digi XBee-PRO modules are power-amplified versions of Digi XBee modules for extended-range applications. Part of the Digi XBee family of RF products, these modules are easy-to-use, share a common hardware footprint, and are fully interoperable with other XBee products utilizing the same technology. Module users have the ability to substitute one Digi XBee for another with minimal development time and risk.

The updated Digi XBee S2C DigiMesh® 2.4 module is built with the SiliconLabs EM357 SoC and offers improved power consumption, support for over-the-air firmware updates, and provides an upgrade path to IEEE 802.15.4 or ZigBee® mesh protocols if desired.

Features
No configuration needed for out-of-the-box RF communications
Common Digi XBee footprint for a variety of RF modules
Simple topology to deploy and grow
2.4 GHz for worldwide deployment
Low-power Digi XBee or extended-range XBee-PRO (pin/over-the-air compatible)
Multiple antenna options
Outdoor RF line-of-sight range up to 2 miles (3.2 km)* with high-gain antennas
DigiMesh® peer-to-peer mesh networking protocol
Documentation
PDF User Guide

Digi XBee S2C DigiMesh® 2.4 Digi XBee-PRO S2C DigiMesh® 2.4
PERFORMANCE
TRANSCEIVER CHIPSET Silicon Labs EM357 SoC
DATA RATE RF 250 Kbps, Serial up to 1 Mbps
INDOOR/URBAN RANGE* Up to 200 ft (60 m) Up to 300 ft (90 m)
OUTDOOR/RF LINE-OF-SIGHT RANGE* Up to 4000 ft (1200 m) Up to 2 miles (3200 m)
TRANSMIT POWER 3.1 mW (+5 dBm) / 6.3 mW (+8 dBm)boost mode 63 mW (+18 dBm)
RECEIVER SENSITIVITY (1% PER) -100 dBm / -102 dBm boost mode -101 dBm
FEATURES
SERIAL DATA INTERFACE UART, SPI
CONFIGURATION METHOD API or AT commands, local or over-the-air (OTA)
FREQUENCY BAND ISM 2.4 GHz
FORM FACTOR Through-Hole, Surface Mount
HARDWARE S2C
ADC INPUTS (4) 10-bit ADC inputs
DIGITAL I/O 15
ANTENNA OPTIONS Through-Hole: PCB Antenna, U.FL Connector, RPSMA Connector, or Integrated Wire
SMT: RF Pad, PCB Antenna, or U.FL Connector
OPERATING TEMPERATURE -40º C to +85º C
DIMENSIONS (L X W X H) AND WEIGHT Through-Hole: 0.960 x 1.087 in (2.438 x 2.761 cm)
SMT: 0.866 x 1.33 x 0.120 in (2.199 x 3.4 x 0.305 cm) Through-Hole: 0.960 x 1.297 in (2.438 x 3.294 cm)
SMT: 0.866 x 1.33 x 0.120 in (2.199 x 3.4 x 0.305 cm)
NETWORKING AND SECURITY
PROTOCOL XBee 802.15.4 (Proprietary 802.15.4)
UPDATABLE TO DIGIMESH® PROTOCOL Yes
UPDATABLE TO ZIGBEE PROTOCOL Yes
INTERFERENCE IMMUNITY DSSS (Direct Sequence Spread Spectrum)
ENCRYPTION 128-bit AES
RELIABLE PACKET DELIVERY Retries/Acknowledgements
FILTRATION OPTIONS PAN ID, Channel, and 64-bit addresses
CHANNELS 16 channels 15 channels
POWER REQUIREMENTS
SUPPLY VOLTAGE 2.1 to 3.6V 2.7 to 3.6V
TRANSMIT CURRENT 33 mA @ 3.3 VDC / 45 mA boost mode 120 mA @ 3.3 VDC
RECEIVE CURRENT 28 mA @ 3.3 VDC / 31 mA boost mode 31 mA @ 3.3 VDC
POWER-DOWN CURRENT <1 μA @ 25º C <1 μA @ 25º C
REGULATORY APPROVALS
FCC, IC (NORTH AMERICA) Yes Yes
ETSI (EUROPE) Yes No
RCM (AUSTRALIA AND NEW ZEALAND) No (Coming soon) No (Coming soon)
TELEC (JAPAN) No (Coming soon) No (Coming soon)